Defects in transistors, such as unwanted impurities and broken chemical bonds in the various layers of the semiconductor, can limit their performance and reliability. These defects are becoming harder ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Using advanced techniques, researchers more-accurately characterized the thermal conductivity of four distinct GaN substrate types along with their defect density, and developed a formula linking the ...

Whether you’re using a leading-edge process node to manufacture a very large system-on-chip (SoC), or using an established node for automotive or Internet of Things (IoT) electronics, critical area ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

Originating as a theoretical prediction in the 1940s, with experimental isolation from graphite in 2004, graphene has quickly become a desirable quantum material used in various application areas, ...