Semiconductor Engineering

Catching Critical Defects In TSVs And Stacked Chips

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
Nature

At-Speed Testing and Delay Defect Analysis in Integrated Circuits

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
EDN

Test methods identify small delay defects

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...
Semiconductor Engineering

Chiplets Add More Inspection And Test Steps

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
InfoQ

How Measuring Defect Mass Helps to Test Critical Product Areas

A monthly overview of things you need to know as an architect or aspiring architect. Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with ...
Electronic Design

Synopsys addresses FinFET defects, embedded-flash test at ITC

Synopsys chose the International Test Conference to highlight two significant initiatives: defect-detection enhancements in TetraMAX ATPG through slack-based cell-aware test capability, and a new STAR ...
Machine Design

NIST, Collaborators Develop New Way of Detecting the Defect Density in Transistors

Defects in transistors, such as unwanted impurities and broken chemical bonds in the various layers of the semiconductor, can limit their performance and reliability. These defects are becoming harder ...