While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Intrinsic neural attractors and extrinsic environmental inputs jointly steer the dynamic trajectories of brain activity ...

Soil erosion is a key hydro-geological hazard and a primary cause of land degradation around the world, and it is increasing due to the combined pressures ...