With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Samsung Electronics has started mass production and commercial shipment of its industry first HBM4 high bandwidth memory. The company has also joined Applied Materials' new EPIC Center, a planned ...

Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead ...

AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Samsung Electronics announced Thursday it had started mass production of next-generation memory chips to power artificial ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

The boom in AI data center building has caused a shortage of memory chips which are also crucial for electronics like ...

Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

TL;DR: Samsung Electronics advances its next-gen HBM4E memory with 13Gbps per-pin speeds, delivering up to 3.25TB/sec bandwidth-over 2.5 times faster than HBM3E-and doubling power efficiency. Targeted ...

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...