As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...
As complementary metal-oxide semiconductor (CMOS) area shrinks 50% from one node to the next, interconnect critical dimensions (CD) and pitch (or spacing) are under tight demands. At the N3 node, ...
Applied is working with all leading-edge logic chipmakers on a growing number of applications for its Sculpta ® pattern-shaping technology Introducing innovative new etch systems, CVD patterning films ...
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