For the first time in history, a pathway for ALD-enhanced materials to be rapidly developed and transitioned from lab-scale to commercial production is available for nearly any application. Until ...

What is Layer-by-Layer Assembly? Layer-by-layer (LbL) assembly is a technique for fabricating multilayered thin films by alternately depositing oppositely charged materials onto a substrate. This ...

This week, Intel presents five papers at the 2022 IEEE Symposium on VLSI Technology & Circuits (VLSI) that describe the company’s progress on Intel 4, the semiconductor process technology formerly ...

Thermwood (Dale, Ind., U.S.) announces a novel process called Cut Layer Additive. This additive approach produces large-format, near-net shape parts at low cost using a less costly additive machine.

On Monday, memory and storage vendor Micron announced that its new 176-layer 3D NAND (the storage medium underlying most SSDs) process is in production and has begun shipping to customers. The new ...

According to this article, those considering SOA may have some tough choices when it comes to driving code at the process layer. Indeed, a report by the Burton Group describes both the limitations of ...

A pathway for ALD-enhanced materials to be quickly developed and transitioned from lab-scale to commercial production is available for almost any application, for the first time ever. Atomic-level ...