Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
A team led by researchers at Rensselaer Polytechnic Institute (RPI) has made a breakthrough in semiconductor development that could reshape the way we produce computer chips, optoelectronics and ...
As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address ...
Creating two-dimentional materials large enough to use in electronics is a challenge despite huge effort but now, Penn State researchers have discovered a method for improving the quality of one class ...
(Nanowerk News) Creating two-dimentional materials large enough to use in electronics is a challenge despite huge effort but now, Penn State researchers have discovered a method for improving the ...
Despite silicon carbide’s (SiC) promise over conventional silicon for the design of next-generation power electronics devices, broad adoption of this high-performance compound semiconductor has been ...
Perfection is not everything, according to an international team of researchers whose 2-D materials study shows that defects can enhance a material's physical, electrochemical, magnetic, energy and ...