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The effectiveness of semiconductor manufacturing test directly impacts the quality and reliability of shipped silicon and the economical efficiency of overall test costs within the supply chain.

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

The size and performance advantages of FinFETs are leading to a general industry adoption of these 3D transistors at the more advanced technology nodes. These complex transistors, however, exacerbate ...