As technology nodes shrink to 90 nanometers and below, chips become much more difficult to manufacture. In-die process variations increase substantially at 90 nm — even more at 65 nm. If these effects ...

Variation is becoming a major headache at advanced nodes, and issues that used to be dealt with in the fab now must be dealt with on the design side, as well. What is fundamentally changing is that ...

Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...

Yields typically improve over time but low yields are always an issue as designs move to finer geometries. Design for yield (DFY) helps improve this situation. ProPlus Design Solutions is one company ...