MEMS Packaging Market to Hit $85.6B by 2030; Driven by 10.1% CAGR and AI Sensor Proliferation | Valuates Reports

MEMS Packaging Market to Hit $85.6B by 2030; Driven by 10.1% CAGR and AI Sensor Proliferation | Valuates Reports ...
IEEE

A Practical Method for Module-Level Capacitance Estimation in Automotive Power Module Using Datasheet-Based Modeling

Abstract: This paper proposes a practical method for efficiently estimating the module-level capacitance of high-voltage power modules used in automotive applications. Traditionally, acquiring the ...

iPhone 18

The foldable iPhone, the iPhone 18 Pro, and the iPhone 18 Pro Max will launch in September 2026, while the iPhone 18 and ...
TweakTown

Apple iPhone 18 with A20 chip could switch to wafer-level multi-chip module packaging

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
MacRumors

A20 Chips in iPhone 18 Models Again Rumored to Feature New Design

Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by ...
ExtremeTech

Raspberry Pi Launches Camera Module 3 Sensor Assemblies

Raspberry Pi launched a follow-up to its Camera Module 3 with the Camera Module 3 Sensor Assembly. Now, Raspberry Pi users can put the camera sensors into their own custom form factors. The move ...