Abstract: In this paper, the thermal performances of a Chiplet module designed with various configurations, such as monolithic die, 2.5D interposer, and 3D stacked dies, were studied and compared. The ...
Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has ...
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